Polyimide Materials

[Tom]

IPC Advanced Study Guide Page Reference: Page 5, Section 1.1

Polyimide

Polyimide offers the highest operating temperature among resin systems in use today. It has been a favorite for military applications where the potential for board rework and repair in the field is anticipated. Polyimide offers a real potential to reduce damage to the board when uncontrolled soldering irons are used to remove or replace a component.

The two beneficial electrical properties that Polyimide Material have are excellent thermal properties and low dielectric constant. Because polyimide materials have excellent thermal properties and low dielectric constant, it is an excellent material for the use of high speed boards.

[davepcb]

Tom,
I'm doing some research on Polyimides (type G30). Do you know where I can find specific information such as:

Young's Modulus
Poisson's Ratio
Density
Yeild Strength
Ultimate Strength?

I've been searching for this info but can only find general info on Polyimides.


davepcb

[Tom]

Dave,

I know exactly what you mean. Good data is hard to find when you need it the most. I personally do not have the data that I can post here, but what I would do is contact my manufacturer or someone who uses and purchases the material. I would ask them first, as the product sales person normally provides all the material characteristics to their customer for their education.

If the manufacturer cannot provide the data, then I would ask for a contact person of the material manufacturer and ask them to provide the data. Normally anyone who sells a product is more than willing to jump through hoops to provide you all the information you need so that you will purchase their products.

[davepcb]

Tom,
Thanks again. It looks like the board manufacturer is my best option. From what I've gathered so far there seems to be a lot of variations in the material and it's used for more than pcb design.


davepcb

[Scicards]

http://www.na.fasson.com/FRNA/FRNASITE.NSF/PG/LNB1C8_NPolyimides?OpenDocument

example from link:

Fasson® 1 Mil Matte White Hi-Temp TC Polyimide/S2831/55# BG Spec# 77501

Facestock:
Fasson® 1 Mil Matte White Hi Temperature Topcoated Polyimide is a durable film facestock featuring excellent tear strength, heat resistance, dimensional stability, and chemical resistance. The high opacity, matte white topcoat was specifically designed for thermal transfer printing. It offers excellent scuff, scratch, UV, and temperature resistance. Can withstand the higher temperatures associated with lead-free solder processes and resists "solder balling."



Basis Weight:
N/A


Caliper:
0.0015 inches ± 10%


Tensile:
MD 24,000 psi
CD 24,000 psi


Tear:
N/A


Stiffness:
N/A

Adhesive:
Fasson® S2831 is a high performance acrylic based adhesive featuring high ultimate peel values. It was specifically designed to resist edge attack by solvents and chemicals used in printed circuit board manufacturing processes. Peel values increase dramatically after the printed circuit board is heated above 392° F (200° C).



Type:
Acrylic


Minimum Application Temperature:
+50° F (+10° C)


Service Temperature Range:
-40° F (-40° C) to >350° F (>176° C)


Typical Performance Data: 1 mil matte white hi-temperature polyimide/S2831 at room temperature on standard lab panels



Stainless Steel
Loop Tack:
Peel Adhesion:

1.6 lbs
1.4 lbs - 20 minute dwell
2.2 lbs - 72 hour dwell

























Liner:
55# BG is a bleached Glassine white liner with excellent roll label converting properties. Not recommended for roll-to-sheet applications. Labels have been successfully dispensed off this liner at moderate speeds using standard automatic dispensing equipment.



Basis Weight:
55# per ream ± 10%
(24" X 36" 500 sheets)


Caliper:
0.0031 inches ± 10%


Tensile:
MD 54# per inch width
CD 23# per inch width


Tear:
MD 55 grams
CD 65 grams

Total Construction Caliper (approximate): 0.0056 inches ± 10%

Printing and Converting
This product is designed for thermal transfer and standard flexographic printing. Can be die-cut and matrix stripped at moderate speeds on standard roll-feed printing equipment. Due to the thinner caliper of this material, auto print/apply systems should be checked carefully.

Applications and Uses
This product is ideal for labeling printed circuit boards as well as for automotive, aerospace, medical and manufacturing applications where high temperature and solvent resistance are critical. It is able to withstand surface mount circuit board processes on either the top or bottom side of the board using high temperature lead-free solder. Can also be used on the top side of the board in mixed processes and recommended for the bottom side when directly exposed to the wave solder environment. UL Recognition with thermal transfer printing. Can withstand up to 500° F (260° C) for 5 seconds.

Compliance Tables:
Recommended Thermal Transfer Ribbons: MANUFACTURER MODEL COMPLIANCE
Dai Nippon :
Union Chemicar :
Iimak: R510
US 300
SP-330 UL Recognized
UL Recognized
Sony :
Sony:
Japan Pulp and Paper :
Ricoh:
Ricoh: TRX75
TR4070
JPP-1
B110C
B110A UL Recognized

UL Recognized
UL Recognized

Thorough testing is strongly recommended in actual end-use environment.

Shelf Life
Unless specified otherwise in this document, one year when stored at 72°F at 50% RH