Thermal reliefs on vias

[waynee]

Is there a reason (manufacturing or another) to have thermal reliefs on a via when it is connected to a (power) plane? I have a high current trace and would like to remove the thermal reliefs to minimize resistance.

I also want to use vias to connect a plane on the top layer to the bottom layer to help cool some heat generating devices (LDO regulators). Having thermal reliefs on these seem counter productive.

I see the need for thermal reliefs on thru-hole componets for assembly and rework, but vias?

[phillipr]

Waynee

I know of no reason to have thermals on vias
I always flood over my via holes.

[Tom]

Waynee,

I take it that you are using copper pour or Split/Mixed planes on your outer layers. If so, adjust the Outer Layer Via Pad Style in Setup/Padstacks/Vias/Pad Style/Thermal so that the ID & the OD are the same value. This will allow the copper to flood over the vias and still give you Thermal Relief on all the Through Hole part pins.

[phillipr]

I Select the plane area - Query - Preferences and tick Flood over vias.
This gives the same result ass Toms suggestion

[rodster]

Is there a way to flood over vias on an inner plane? I know if I set up the layer as split/mixed and cam out it as routing layer it will flood over. But if you set it up as a plane and cam it out as a plane, it will add thermals to the vias.

[chuckt]

I assume your talking about negative planes? There is a check box in the cam documents options dialog box that will toggle cam thermals.

[rodster]

I didn't see that option, Thanks.