John Wagstaff
09-05-2002, 02:19 PM
I am running into a problem and would like to get opinions from Tom and others on this.
I am using 0402 chip components in many of my designs (very small board sizes). I typically place the parts on a .05mm grid and in the design rules under "body to body" I use .05. This forces me to keep a .05mm space between courtyards. This approach has worked well in the past.
The question I have is, does anyone use zero clearance between courtyards? See attached file for an image of two 0402 resistors in this configuration.
If placing these components courtyard to courtyard... then the space between lands is .1mm. Some board houses can handle this, some can not. Even if the board house can fab the board, there is a bigger problem... assembly. The distance between the actual components is also .1mm. (based on IPC definition of a nominal 0402 resistor) Now the problem is that typical pick and place equipment has a tolerance of +/- .1mm. So there could be a scenario where R1 is placed offset in Y axis (toward R2) by .1mm and R2 is offset in Y axis (toward R1) - end result is interferance of the parts.
If the pick and place equipment had better accuracy then this wouldn't be an issue. I've been looking at Fuji equipment and contacting different assy shops about this. The assy shops said that they would like 10mil clearance between comps. Is 10mil realistic? Not sure... what do you think?
I am using 0402 chip components in many of my designs (very small board sizes). I typically place the parts on a .05mm grid and in the design rules under "body to body" I use .05. This forces me to keep a .05mm space between courtyards. This approach has worked well in the past.
The question I have is, does anyone use zero clearance between courtyards? See attached file for an image of two 0402 resistors in this configuration.
If placing these components courtyard to courtyard... then the space between lands is .1mm. Some board houses can handle this, some can not. Even if the board house can fab the board, there is a bigger problem... assembly. The distance between the actual components is also .1mm. (based on IPC definition of a nominal 0402 resistor) Now the problem is that typical pick and place equipment has a tolerance of +/- .1mm. So there could be a scenario where R1 is placed offset in Y axis (toward R2) by .1mm and R2 is offset in Y axis (toward R1) - end result is interferance of the parts.
If the pick and place equipment had better accuracy then this wouldn't be an issue. I've been looking at Fuji equipment and contacting different assy shops about this. The assy shops said that they would like 10mil clearance between comps. Is 10mil realistic? Not sure... what do you think?