Tahir
08-28-2002, 07:48 AM
Hello everyone
I made a BGA decal (with via in decal) in Power PCB. Some of
via were up (south) from pad and some were down (north)
of pad. When performed JEDEC pinning, A8, B8, E8 were missing.
Does anyone know what is the problem. Thanks
I made a BGA decal (with via in decal) in Power PCB. Some of
via were up (south) from pad and some were down (north)
of pad. When performed JEDEC pinning, A8, B8, E8 were missing.
Does anyone know what is the problem. Thanks