BGA Fannout tip 2

[phillipr]

When fanning out of a 0.8 mm pitch consider using unconnected pads to your advantage. In doing this you can get a 0.125 (5 thou
trace out of a bga without compromising 5/5 in your design rules.

Unfortunately blaze or drp do not take this into account (Verify design does) so it is purely a manual process.

By using a step down layer process you will always have unconnected pads between the pad you are routing from and the edge of the component


O O O O O O---- Layer 1
O O O O O------- Layer 2
O O O O---------- Layer 3

Ps- To take advantage of the remove unused pads feature all the layer must be setup as split/mixed

[phillipr]

After some investigating this procedure has brought up an issue that needs addressing by innoveda

Verify design in powerpcb understands unused pads but blaze Latium design verification does not.

This causes serious issues as if I use decal rules I cannot use the normal verify and if I use this unused pads feature I cannot use the Latium Verify.

Unfortunately on this my current design I use both and im to far down the layout process to change either.

I do not want to have thousands of errors on my board as I wont fill comfortable sending it out.