View Full Version : Lead-Free
Claudia
06-17-2002, 10:35 PM
In 2004 we will bring a new product in Europe to the market. Does anyone have experience with leadfree designs? Will our product need to be leadfree by 2004?? Where can I get some information??
I know a lot of questions for a new member :-).
Claudia
Claudia,
Lead Free is a marketing ploy. When a Japanese company announced that they had converted their product to "Lead Free" they sold more units. Now Japan is on a ban of products that contain lead. They want to become a "Lead Free" country (so does Europe).
The big thing is IPC has publicly stated that there is no apparent harm in Lead solder on printed circuit boards. There is no health or environment risk. But that doesn't change Legal legislation regarding the ban of products containing Lead in Europe and Japan. Both nations are scheduled to implement a "Ban on Lead Products" starting January 1st 2004. How strictly this will be enforced or even if it will become law is still up in the air.
All the manufacturers of fabrication and assembly equipment are up in arms. Companies that sell Immersion White Tin lines are blasting the HASL lines with rhetoric and hype so they can sell more of their equipment. They are making statements that are persuading the elimination of lead in solder like any underdog competitor would.
Bottom line is that this subject is under great debate, but my personal feeling is that "Lead Free" will win out. So I would look for alternatives to lead.
Right now you can purchase Silver Plating at Hallmark Circuits cheaper than "Hot Air Solder Leveling" (HASL). At TYCO you can purchase Nickel/Gold (NiAu) plating cheaper than HASL. There are several companies now that sell "Lead Free" solder for assembly. Talk to anyone at Plexus. So you really do not have any problems eliminating solder from your processes.
The person with some great insight information on this entire Lead Free debate is Tom Scimeca, Ph.D. of Florida CirTech, Inc. Office: 949.389.9995 or Cell: 949.678.2224 or e-mail: tomscimeca@aol.com. Tom sells Immersion White Tin Line equipment to manufacturers and keeps up to date with the "Great Lead Free Debate"
Claudia,
I just read in the June issue of Printed Circuit Design - Page 29.
It's an article regarding "The Quest for the Ultimate Board Finish".
The European Commission is leading the world to make the electronic industry "greener". They are imposing restrictions on the Europeon electronics industry and their suppliers to eliminate lead in their products by 2008. Many legislators around the world are pursuing the same. This makes the HASL (Hot Air Solder Leveling) board finish questionable in the near future.
From this article it seems that Europe has pushed back it's agressive 2004 mandate till 2008.
Colorado-PC-Dude
06-19-2002, 08:50 AM
Tom and Claudia,
I was talking to one of our board vendors a while back. In 1982 he was told that in FIVE YEARS there would be no lead in PCBs. Twenty years later we're still hearing essentially the same thing.
On the other hand, Oregon banned the sale of regular leaded gasoline because of the lead content even though "leaded" gasoline hasn't had lead in it since the late seventies. So here we are using a product that is no safer for the environment and paying a premium for it.
Will they ever get lead out of PCBs? Probably depends on whose report the government officials read. There are a lot of alternatives available already so I'll worry about it if and when it happens.
Ben
Claudia,
Here's a website that I found that discusses the Lead Free subject in the EU........
http://download.lead-free.org/downloads/EU_roadmap_V1.pdf
June 20, 2002
SUBJECT: IPC and JEDEC 1st International Pb-Free Conference, May 2002, San Jose, CA., USA - Conference Proceedings
Dear Mr. Tom Hausherr,
Thank you for your interest in the first IPC and JEDEC International Conference on Lead-Free Components and Assemblies. From the attendance of the conference, it is obvious that this is a timely topic. Although some of you were unable to attend, we would like to inform you that a CD-ROM version of the Lead-Free Conference Proceedings is now available from the JEDEC Office.
If you, or your colleague would like to order additional copies of the proceedings, simply complete the linked form ( click here http://www.jedec.org/lead_free/CD-PB-Free-order_form.pdf ) and fax, phone, or mail it as indicated on the form.
Negotiations are presently underway to possibly hold the 2nd IPC and JEDEC International Conference on Lead-Free Components and Assemblies in December 2002 in Taipei, Taiwan.
Sincerely,
Angie Steigleman
IPC/JEDEC Assistant Conference Coordinator
angiem@eia.org
Ingrid M. Taylor
JEDEC Director
itaylor@eia.org
IPC President Visits Capitol Hill On Behalf Of Small Businesses
Denny McGuirk, IPC president, recently testified before the House of Representatives Small Business Committee Government Reform and Oversight Subcommittee on "The Lead Toxic Release Inventory (TRI) Rule: Costs, Compliance and Science."
The hearing took place June 13, 2002, and, in addition to McGuirk, included the following witnesses: Kim T. Nelson, assistant administrator for Environmental Information, U.S. Environmental Protection Agency (EPA); James Mallory, executive director, National Non-Ferrous Founders' Society; Nancy Klinefelter, president, Baltimore Glassware Decorators, Representing Society of Glass and Ceramic Decorators; and Hugh Morrow, president, North American Office, International Cadmium Association. The subcommittee consisted of Committee Chairman and Congressman Mike Pence (R-Ind.) and Ranking Member Robert Brady (D-Penn.).
IPC president, Denny McGuirk, testifies before the House of Representatives Small Business Committee Government Reform and Oversight Subcommittee on "The Lead Toxic Release Inventory (TRI) Rule: Costs, Compliance and Science."
In his testimony, McGuirk voiced industry concern over the EPA’s lowering of the reporting threshold for lead and lead compounds from 25,000 to 100 lbs., under the TRI rule, and its decision not to convene an Advocacy Review Panel as required under the Small Business Regulatory Enforcement and Fairness Act.
"IPC members, along with many other industries, are concerned that the burden of this rule upon business has been significantly underestimated," said McGuirk. "To make matters worse, EPA has failed to provide effective compliance assistance, thereby further increasing the burden on those least able to bear it.
"Last month…EPA acknowledged that there had been problems with the implementation [of the rule], but noted that the first year of a regulation always serves as a ‘road-test.’ That may be EPA’s perspective on the problem, but it is not shared by the thousands of small businesses that will become the accident victims as EPA takes its ‘test drive.’ Moreover, such a cavalier disregard of major problems identified by small business suggests they are at the risk of becoming the road-kill of EPA’s road test."
In his conclusion, McGuirk requested that EPA suspend or delay their lowered reporting thresholds for lead until small business concerns could be addressed properly and the results of EPA’s Science Advisory Board’s review could be completed and assessed.
Also during the hearing, Representative Pence questioned Assistant Administrator Nelson about the scientific community’s support for the rule, voicing his concern that it represented a misallocation of EPA’s resources and would put a great burden on small businesses.
IPC advises its members to prepare for compliance with the July 1st reporting deadline, but encourages small businesses to hold their filings until June 30, 2002.
The witnesses’ complete testimony can be viewed at www.house.gov/smbiz/hearings/107th/2002/020613/index.html.
To All,
IPC and JEDEC once again joined forces to host the 2nd International Lead Free Conference tentatively scheduled for December 9 - 11, 2002 in Taipei, Taiwan.
December 9, 2002 - Educational Course
December 10 - 11, 2002 - Technical Conference
Details concerning the conference will be announced as they become available; however, today we are calling your attention to a CALL FOR PARTICIPATION. Information concerning submission of papers, areas in which papers are being sought and associated deadlines can be found in the attached.
Web site (will be expanded in the future):
http://www.pb-free.org/
PDF version of call for paper:
http://www.pb-free.org/CFP-Final.pdf
Sincerely,
Martin G. Freedman, Molex, Inc.
E-mail: mfreedman@molex.com
Conference Chairman
Ingrid M. Taylor
JEDEC - Conference Coordinator
E-mail: itaylor@eia.org
Implementation of Lead-Free Solder
Thursday, November 14, 2002
10:00 am - 12:00 pm Central Standard Time
Developments in Europe and Asia are dramatically impacting the use of lead-free solder. Did you know, in Europe for example, it now appears any goods put on the market (for sale) after January 2006 must be lead-free regardless of when it was manufactured? Or that major OEMs in Japan, like Sony and Hitachi, are producing lead-free products?
Regardless of where you are in the electronics industry supply chain, you need to understand not only the environment (both legislative and customer driven), which more than likely will drive your company to use lead-free solder but the types of the lead-free solder available.
Course Syllabus
10:00 am
Introduction
An Overview of Lead-Free and IPC's Position
David Bergman, IPC Vice President of Standards,
Technology and International Relations
10:30 am
Environmental Update on Lead-Free
EPA Speaker
11:15 am
An Analysis of Global Lead-Free Technology Developments
Peter Palmer, Vice President, Cookson Electronics, and Chair of the IPC Solder Products Value Council
11:45 am
Questions and Answers
Dear Mr. Tom Hausherr,
IPC - Association Connecting Electronic Industries and JEDEC - the Solid State Technology Association are jointly sponsoring the 2nd International Conference on Lead-Free Components and Assemblies from December 9 - 12, 2002 at the Grand Hyatt Taipei Hotel, Taipei, Taiwan. To get the latest details on the program, to register, make reservations and for companies interested in showcasing their products, please visit our website by clicking on the below conference logo, or visit the web site http://www.Pb-Free.org.
For a downloadable form you can fax.
MARK YOUR CALENDAR:
December 9 - 12, 2003 Lead-Free Conference
Register with IPC by November 15, 2002 either by mail:
IPC Dept. 77-3491, Chicago, IL 60678-3491 or by fax: 847.509.9798.
Please contact the JEDEC Office 703.907.7558 or ingridt@eia.org if you have questions.
With best regards,
Ingrid M. Taylor
Best Regards,
JEDEC Staff.
Implementation of Lead-Free Solder
Thursday, November 14, 2002
10:00 am - 12:00 pm Central Standard Time
Developments in Europe and Asia are dramatically impacting the use of lead-free solder. Did you know, in Europe for example, it now appears any goods put on the market (for sale) after January 2006 must be lead-free regardless of when it was manufactured? Or that major OEMs in Japan, like Sony and Hitachi, are producing lead-free products?
Regardless of where you are in the electronics industry supply chain, you need to understand not only the environment (both legislative and customer driven), which more than likely will drive your company to use lead-free solder but the types of the lead-free solder available.
Course Syllabus
10:00 am
Introduction
An Overview of Lead-Free and IPC's Position
David Bergman, IPC Vice President of Standards,
Technology and International Relations
10:30 am
Environmental Update on Lead-Free
EPA Speaker
11:15 am
An Analysis of Global Lead-Free Technology Developments
Peter Palmer, Vice President, Cookson Electronics, and Chair of the IPC Solder Products Value Council
11:45 am
Questions and Answers
http://www.ipc.org/html/CFPLeadFree403.pdf
In conjunction with IPC, one of the world’s most respected experts in lead free technology is offering a series of local workshops to provide industry technical professionals with the information needed to transition to lead free systems. Dr. Jennie S. Hwang, president of H-Technologies and author of over 200 publications and five textbooks, will teach a two-part course focused on lead free implementation and lead free surface finishes. The courses will be presented in locations all over the country to maximize attendee convenience and awareness of this important subject.
The course will be presented in two parts so attendees can select the more subject matter that appeals the most or stay for the entire day. Attendees can save $100 by signing up for both parts.
Part 1, 8:30 am – 11:30 am: Lead-free System--Lead Free Interconnections-Technology, Applications and Selections
Part 2, 1:00 pm – 4:00 pm: Lead free System--Lead Free PCB Surface Finish & Component Coating
The course will be offered in the cities listed below. For complete course descriptions, or to register, visit the IPC calendar of events and select the workshop (part 1 or part 2) being held in your location:
March 3, 2003, Monday--Durham, NC
March 5, 2003, Wednesday--Orlando, Florida
March 10, 2003, Monday--Arlington, VA
March 12, 2003, Wednesday--Boston, MA
March 19, 2003, Wednesday--Dallas, TX
March 21, 2003, Friday—Austin, TX
April 28, 2003, Monday--Atlanta, GA
April 30, 2003, Wednesday--Chicago, IL
Any other queries, please contact Nilda Mendez at 847-790-5329, e-mail NildaMendez@ipc.org.
By David Manners, Electronics Weekly -- Electronic News, 2/26/2003
MONTEREY, Calif. -- U.S. companies are beginning to wake up to the lead-free electronics production movement, which was pioneered in Japan and taken up by European manufacturers.
“We’ve just started to get enquiries from US customers about lead-free products,” Julian Psaila, manager of MIPS processors at PMC-Sierra Inc., told the Globalpress Leading the Recovery conference this week.
According to Psaila, until recently, there was little interest in lead-free components in the U.S.
"A few of our printer manufacture customers are now asking about it, probably because they want to ship products to Europe and products containing lead may be banned from the European market,” Psaila said.
PMC-Sierra is already shipping some of its MIPS processors in lead-free packages and plans more.
“The lead-free movement started in Japan -- not as a legislative thing but as a voluntary movement probably to help consumer marketing,” Psaila said. “In Europe it’s more of an EC-driven thing to have lead-free products by 2006.”
Only this month Texas Instruments Inc. announced its intention to go entirely lead-free for its logic products.
The 3rd International Conference on Lead-Free Components and Assemblies, jointly sponsored by IPC and JEDEC, is now open for registration.
If you are involved in the environmental and recycling aspect of electronics, you cannot afford to miss this major international event on April 22 - 24, 2003 in San Jose, California. It offers more of everything than any other event in the field such as technical presentations, tutorials, guest speakers and educational classes.
To get the latest details on the Program and to register to make Reservations, please visit our website www.pb-free.org or http://ipcmail.ipc.org/leadfree3/leadfree4.html
MARK YOUR CALENDAR:
April 22, 2003 - Educational Courses
April 23 - 24, 2003 - Technical Conference
LOCATION: Fairmont Hotel, www.fairmont.com
170 S. Market Street
San Jose, CA
Tel. (408) 998-1900 (Ask for the Lead-Free Conference rate)
Deadline for Reservations: April 4, 2003
Rate: $149.00 Single/Double
We hope to see you there.
Best Regards,
Ingrid Taylor
ingridt@jedec.org
North American Advanced Technology Tour
Event (from April 9th, 2003 till May 21st, 2003, North America)
You can register here,
http://www.vitronics-soltec.com/vis/vis_event.nsf/Registration?openform
Vitronics Soltec invites North America Electronics Manufacturers to the "Make the Right Connection in Lead-Free Soldering"
18-City LEAD FREE SEMINARS TOUR
Meet the Challenges of the New Reality
In these tough times of tighter budgets and shrinking margins, you must remain profitable to survive. Increasing process efficiency as well as increasing yields by cutting defects and overall costs can widen narrow profit margins. That's why Vitronics Soltec announces the North American Advanced PCB Assembly Technology Tour, with this year's theme "Make the Right Connection in Lead Free Soldering".
Building upon our research and customer experiences, this year's program will illustrate the 5-Step Method to achieve an efficient Lead Free soldering process. Included will be the impact various soldering technologies have on cost, process control, yield, and experiences of those assembling with Lead Free technologies.
Today's Critical Market Trends
Where is the Market going? The electronics industry is witnessing a revolution in the business practices of OEM's, CMS's, Device Manufacturers, IC packagers, Material Suppliers, and Process Equipment Manufacturers. It's a tough environment and one to which we must adapt. In this seminar we will examine how the electronics world is redefining itself. We will provide you with the latest development in technology and manufacturing, including Lead Free mandates, the momentum for ISO 9001 and 14001 certification, and the impact of China.
Lead Free Implementation – 5 Steps and Case Studies
There are many Japanese manufacturers currently producing Lead Free electronic products with the prospect of gaining market share. In Europe, implementation of the WEEE and RoHS directives by June 30, 2006 in the EU will mark the end of the eutectic tin-lead era for most electronic applications.
For the North American assembly market, those companies with interests both domestically and globally will need to follow suit in adopting a Lead Free process. Successful implementation of Lead Free soldering requires careful, well thought-out planning and rigorous process monitoring to ensure quality and to keep the process in control. It demands a comprehensive process definition, proper material selection, and methodical ongoing review and analysis.
Our 5 Steps to Successful Lead-Free Soldering – reflow, wave, and selective- illustrates how to achieve a robust, repeatable Lead Free soldering process that will deliver consistent high yields. You will learn from the real life experiences of others with actual process data and case histories. Discussions will include the impact of legislation, standards, compatibility of materials, and the increased need for standard SPC measurements for all types of soldering processes.
Selective Soldering: Get The Most Out Of This Powerful New Process
Best described as an "Enabling Technology", Selective Soldering is highly capable and flexible. The seminar will review every aspect of the process, from fluxing and preheating to Selectwave versus Multiwave solder wave types. And we will show you how to best use these two different approaches – separately or together – to achieve optimum results in high mix production.
Then, we'll start you thinking "outside the machine" and discuss how total web integration and control adds a greater dimension to the machine and the process. Actual application data and process parameters will be discussed.
Optimize Your Reflow Process
The Lead Free reflow process window is tighter compared to the soldering process window of tin lead assemblies. Achieving a reflow process that does not exceed the maximum peak temperature rating of the various materials BUT also achieves the minimum peak temperature necessary to form that reliable joint is critical. Simultaneously, other reflow process parameters such as the Preheat Condition, Time Above Liquidous, and Cooling Conditions are equally essential in delivering a high yield electronic product.
The seminar will help you keep your reflow process optimized, in-control, and flexible enough to keep an open "process window" in the face of these future challenges. We'll look at lead-free process considerations including temperature, dT, throughput, footprint, cooling rates, nitrogen usage, and other important process variables.
Cost-Effective Lead-Free Wave Soldering
Wave soldering with lead-free alloys continues to advance! Several major electronic assembly houses are currently in mass production with Lead Free solders. We will assist you in identifying and understanding critical process problems including: poor yield, fillet lifting, decreased wetting, costly dross, and the leaching of metals into the solder pot. Again, we will use real-life solutions already implemented by other assemblers. And we will teach you how to apply SPC tools and analysis to optimize and maintain your production.
Question & Answer Session
After the seminar, join us for a lively question and answer session.
Narrow profit margins are a fact of life in the industry today. Building a more efficient soldering process and utilizing less-costly procedures, cutting waste, and reducing defects will boost profitability. We'll show you how.
Program
08:30 hrs. - Registration
09:00 hrs. - Introductions
09:05 hrs. - Trend's in the Electronic Industry
09:45 hrs. - 5 Steps to Lead Free part 1
11:00 hrs. - Break
11:15 hrs. - 5 steps to Lead Free part 2
12:30 hrs. - Lunch
13:30 hrs. - Selective Soldering: Get the most out of this powerful new process
14:30 hrs. - Optimize your Reflow process
15:15 hrs. - Cost effective Wave Soldering
16:00 hrs. - Questions & Answers
16:15 hrs. - Closing Speakers
Denis Barbini, Ph.D.
Manager, Advanced Technologies
Vitronics Soltec
Denis Barbini is the Advanced Technologies Manager for Vitronics Soltec. Denis has presented numerous seminars and papers at conferences worldwide on topics including Lead Free processing, Lead Free reliability, material analysis and behavior, and 0201 processing. Denis manages the technology roadmap and directs the technology projects for Vitronics Soltec. He is a member of SMTA, IPC, NEMI, and ACS. Collaborations with these organizations have resulted in a comprehensive understanding of the global Lead Free directive. Currently, research interests include the impact of lead-free alloys on wave, reflow, and selective soldering, material analysis, semiconductor processing, and optoelectronics.
Marc Dalderup
Vice President, Sales and Support Americas
Vitronics Soltec
Marc Dalderup is the VP of Sales and Support for Vitronics Soltec Americas. He has worked in the electronics industry since 1983 and is recognized for his dynamic and comprehensive presentations on the subject of Soldering. Marc's primary focus is working globally with large OEM and CEM accounts in optimizing their solder processes.
Costs
Seminars are free to our invited guests.
Materials
Each participant will receive a CD with all key presented presentations.
Locations
Make the Right Connection in Lead-Free Soldering Advanced Technology Tour 2003
DATE - CITY
9 April 2003 - Tampa, FL
10 April 2003 - Charlotte, NC
15 April 2003- Reynosa, Mexico
16 April 2003 - Dallas, TX
17 April 2003 - Atlanta, GA
22 April 2003 - Guadalajara, Mexico
24 April 2003 - Juarez, Mexico
29 April 2003 - Portland, OR
30 April 2003 - San Jose, CA
1 May 2003 - Orange County, CA
6 May 2003 - Bloomington, MN
7 May 2003 - Kenosha, WI
8 May 2003 - Indianapolis, IN
13 May 2003 - Toronto, Canada
14 May 2003 - Auburn Hills, MI
15 May 2003 - Columbus, OH
20 May 2003 - Princeton, NJ
21 May 2003 - Marlborough, MA
You can register here,
http://www.vitronics-soltec.com/vis/vis_event.nsf/Registration?openform
or call Vitronics Soltec, Tina Carline at 2 Marin Way, Stratham, NH 03885 USA.
Tel. +1-603-772-7778 ext 209 / Fax +1-603-772-7776 / Mail: tcarline@us.vitronics-soltec.com
We know that many of you have already registered for the 3rd Annual International Conference sponsored by IPC and JEDEC on Lead-Free Electronic Components and Assemblies to be held April 22 - 24, 2003 at the Fairmont Hotel, San Jose.
There is still time to register for the conference with numerous technical presentations and four educational courses:
• Practical Guide to Lead-Free Assembly and Soldering
• Lead-Free Interconnection - Technology, Selection and Applications
• Electronic Manufacturing with Lead-Free, Halogen-Free and, etc.
• Lead-Free PCB Surface Finish and Component Coating
A networking reception and lunches are included in the price of the conference.
JEDEC and IPC are pleased to note the international presence from Canada, Taiwan, Germany, Mexico, United Kingdom, Japan, Thailand and the USA.
For details, registrations and hotel accommodations, please visit our website http://www.pb-free.org.
Best Regards,
Ingrid Taylor
ingridt@jedec.org
robert Tarzwell
04-09-2003, 11:06 AM
Tom I am surprised at the theory you propose that lead solder in printed circuit boards does not hurt the enviroment, bull as some of the boards end up in a land fill some time after there usable life, they will be subjet to leaching the lead salts into the water flowing though the land site, even with trying to collect the water and treat it. To all the boards that end up along our roads or in small dumps they definnetly do pose a threat. The lead content does have an effect on hot air operators and solder assembliers. and no matter what the IPC says its time to get the lead out. and PS gasoline definitly did have some tetra lead in it till the early 90's when it was replaced with what some are saying a worse subsetute. Phospate. I converted my PCB facility to a plated pladdilm in the 90's and it worked well, untill the supplyer stopped producing it.
Robert,
I agree with you. Just to set the record straight, it is the IPC organization that did the environmental impact studies and summarized that it was minimal.
I personally would like to see all Lead Products eliminated.
The replacement of hot air solder leveling (HASL) has been an area of concern for the PC board industry, which wants to reduce thermal shock to the board during HASL processing and to provide a flatter and more uniform finish for fine-pitch assembly.
Options for lead-free surface finishes, compatible with components and circuit boards, include organic solderability preservative (OSP), nickel/gold, palladium, electroless palladium/electroless nickel, palladium/gold, nickel/palladium/ gold, tin, silver, lead-free HASL tin/copper, immersion silver, immersion gold/electro less nickel and tin/bismuth.
Many studies of lead-free solders have examined either freshly cleaned copper or copper with OSP. The Printed Wiring Board Manufacturing Technology Center (PWBMTC) is conducting a study of board finishes for lead-free solders.
Another issue, that of PC board compatibility with high soldering temperatures, requires the use of high-temperature laminates, which are more expensive. In this context, low-temperature lead-free solders may be an option."
http://www.chipscalereview.com/issues/0300/solder15.html
"Soldering Temperatures
Lead-free high tin alloys require higher processing temperatures in both wave (approx. +10°C) and reflow (+20-25°C), which could damage components' plastic packages, cause board warping and problems with the solderable finish. Traditional SnPb HASL finish boards can be replaced by suitable alternatives, including SnAgCu HASL, NiAu immersion, tin or silver coating (e.g. FST® or Alpha Level®) and organic solderability preservatives (e.g. Entek®). Equipment concerns such as working for extended periods at higher temperatures should also be considered."
http://www.alphametals.com/lead_free/
"Teledyne Halco Dedicated to developing and implementing a lead-free HASL process that is compatible with PCB manufacturing and assembly standards by January 2001."
http://www.leadfree.org/USMarketPerspectives.htm
"Lead-Free Hot Air Solder Level (HASL)
Even though lead-free HASL is available for PWBs, some manufacturers may choose to move away from this process if required to produce lead-free product.
If chosen, alternative HASL finishes will most likely work well with most alternative alloys and will wet faster than plated finishes or coatings. Concerns with this finish include warpage due to higher processing temperatures and PWB absorbed process chemistries, although they can sometimes be removed with cleaning."
http://www.leadfree.org/hasl.htm
http://www.itmconsulting.org/lead-free.html?50
IPC and JEDEC bring you the Fourth International Conference on Lead Free Electronic Assemblies
October 21 Education Courses October 22-23, 2003 Technical Conference
Frankfurt, Germany
IPC - Association Connecting Electronics Industries and JEDEC - the Solid State Technology Association are sponsoring the 4th International Conference on Lead Free Electronic Assemblies from October 21-23, 2003 in Frankfurt, Germany (Hotel to be confirmed) Messrs. Martin Freedman, Molex, and David Bergman, IPC, are the Conference Chairs.
The European Union has drawn the line in the sand. 1 July 2006 is the date that the Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment will require the majority of electronic products sold in Europe to be lead free. Global public and political pressure against lead continues to grow. International OEMs are becoming more sensitive to the issue and continue to press their suppliers to develop phase-out plans. A ban in Europe will have an effect in the global marketplace, forcing all manufacturers to eliminate lead as effectively as a local ban. Manufacturers in all regions, including Asia, will need to prepare for this change. Companies not directly affected by the legislation, in exempted markets, still need to be monitoring this issue to assess the effects of changes in the supply chain and customer demand.
Data keeps coming in from individual companies’ and consortia efforts. Many challenges still exist and the path forward to success is not one of consensus. Companies need to stay aware of the hot issues in order to focus efforts that will allow success to be achieved by 2006.
Papers are sought in all areas, including:
· Component issues (moisture sensitivity, BGAs, obsolescence, etc.)
· Design issues (for ease of production and disassembly)
· Material availability and toxicity issues
· PCB issues (effects of lead free process temperatures, board finishes, etc.)
· OEM/Consumer demands/voluntary elimination dates
· Recycling options (examples, plans and concerns)
· Business issues (supply chains, cost – benefit analysis, etc.)
· Reliability evaluations (temperature cycling data, tin whiskers evaluations)
· Finishes issues (organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.)
· Alternative assembly processes that may facilitate lead free implementation.
· European/other legislation on hazardous materials and recycling, policy enforcement, etc.
· Alloy comparisons (mainstream and specialty)
· Repair and rework (process control, mixed alloy systems, etc.)
· Lead free and other product sectors (automotive, aerospace, etc.)
· Business issues (supply chains, cost – benefit analysis, etc.)
· Alternative means of substitution (conductive adhesives, etc.)
· Legislative exception list – dealing with supply chain changes
The International Conference on Electronic Assemblies offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit an abstract, please complete the second page of this form and include an abstract of 200-300 words along with a brief biography (or you may provide the same information via e-mail to DavidBergman@ipc.org). The deadline for abstract submission is August 15, 2003.
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than a company’s product. It is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation. If your paper is accepted, the deadline for paper submission is September 26, 2003. Speakers will receive free admission to the conference, including a copy of proceedings.
EDUCATIONAL COURSES
Proposals are also solicited from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) to a class of up to 30 persons on topics in the field. Examples include; reliability, process issues, rework, plating and surface finishes, design for lead free, design for recycling, etc. Additional suggestions are also welcome.
An honorarium is offered to tutorial and workshop instructors. A brief description and additional information on any such proposals should be submitted according to the guidelines for abstract submission, i.e., by completion of the attached form.
SPONSORSHIPS AND EXHIBITS
Companies interested in event sponsorship opportunities or exhibiting in our tabletop exhibition space please email JeanHebeisen@ipc.org.
REGISTRATION INFORMATION
If you are interested in receiving registration information regarding the IPC/JEDEC International Conference on Lead Free Electronic Assemblies, please send an email to LFGermany@ipc.org.
Proposed Presentation
International Conference on Lead Free Electronic Assemblies 2003
October 21-23, 2003 Frankfurt, Germany
Complete and mail, fax or e-mail this form with your biography and abstract to:
David Bergman, Vice President of Technical Standards and International Relations
IPC – Association Connecting Electronics Industries
2215 Sanders Road
Northbrook, IL 60062-6135 - USA
Fax: (847) 509-9798 / E-mail: DavidBergman@ipc.org
Name
Company
Title
Street Address
City
State/Zip Code
Phone
Fax
Email
On a separate page, please include your 200-300-word abstract describing the presentation you wish to have considered for the International Conference on Lead Free Electronic Assemblies 2003.
Presentation Title:
Presentation Slot Desired: 30 minutes - 45 minutes
Indicate the general area of Lead Free Technology:
Design
Applications
Assembly
Components
Market
Packaging
Materials
Other
Has this paper been presented before? Yes No
If yes, when and where?
· Send Proposal prior to August 15, 2003
· Paper Submission due before September 26, 2003
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--Technology and Manufacturing
October 31, 2003 - Spring Hill Suites by Marriott ♦ San Diego, CA
The purpose of the course is to provide broad-based information, as well as specific critical factors for the implementation of lead free manufacturing. Environment-friendly manufacturing and end-use products that are ultimately safer at the end of life cycle are essential to technology-business competitiveness. This workshop will cover global legislative status, technological base, product assessment and manufacturing considerations.
What You Will Learn
· Driving forces
· Legislation update–US, Japan, Europe
· Pb-free criteria & definition
· Pb-free technological base & comparison of viable Pb-free alloy options
· Global implementation status
· Pb-free BGA, CSP, and flip chip solder ball performance
· Pb-free SMT manufacturing in reflow and wave soldering vs. alloy melting temperature
· Pb-free SMT manufacturing—intrinsic wetting
· Alloy selection--critical criteria
· Optimal reflow profiling vs. Pb-free system reliability
· High fatigue-resistant Pb-free alloys
· Differentiation of solder joint failure modes between SnPb and Pb-free
· Manufacturing factors - cost vs. performance
· Fillet-lifting—causes and solutions
· Pb contamination effects
· Recommendations
Price: $295 IPC Members $395 Non-members special discount available
To download the registration form, click on the link http://ipcmail.ipc.org/wkshp_12/wkshp_12.html, or contact Nilda Mendez at mendni@ipc.org or via phone at 847-790-5329.
Lead Free System—Part II: Lead Free Components & PCB Surface Finish
October 31, 2003 - Spring Hill Suites by Marriott ♦ San Diego, CA
This course will provide an understanding of the important factors that determine the solderability and performance of surface finishes and component coatings under SMT manufacturing. The viable material and process options of PCB surface finish and component lead-coating will be separately reviewed. The instructor will discuss the role of intermetallics and gold, tin whisker, black pad issue and Bi effects.
What You Will Learn
· Purpose of surface finish and lead coating
· Solderability-principle & definition
· Viable options of Pb-free component lead coating/terminations
· Role of intermetallic to solderability and in Pb-free solder joints
· Role of gold, palladium to solderability and in Pb-free solder joints
· Tin whisker – phenomena, factors
· Viable options of Pb-free PCB surface finishes
· Characteristics of various Pb-free surface finish systems
· Organic coating (OSP) vs. metallic
· Relative performance of Pb-free surface finishes with Pb-free solder joints
· BGA Black-pad—causes and solutions
· Bi effects
· Discussions on compatibility issues in Pb-free system
· Recommendations
Price: $295 IPC Members $395 Non-members special discount available
To download the registration form, click on the link http://ipcmail.ipc.org/wkshp_13/wkshp_13.html, or contact Nilda Mendez at mendni@ipc.org or via phone at 847-790-5329.
U.K. electronics manufacturers are not taking the lead-free directive seriously, and many may fail to meet the deadline of July 2006.
Coventry-based semiconductor distributor Dionics contacted 100 small and medium sized companies with between 100 and 500 employees and found that 61 percent had no plans in place to meet legislation banning lead and other hazardous substances.
Read More.......
http://www.reed-electronics.com/electronicnews/index.asp?layout=article&articleid=CA330955&stt=000&industryid=21372&industry=Packaging&rid=0&rme=0&cfd=1
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