langren
11-04-2008, 04:41 PM
Hi guys,
I am very new to the PCB industry. Have a couple of questions that had bothered me. Hope you guys can help me out.
1) If we can use a solid via fill using conductive pastes to enable interconnection between layers, then why do most people still copper plate the side walls of the via holes first before filling the holes with conductive pastes. Isn't this double work?
2) For small via hole sizes, why do some people not metallized the vias completely using plating and instead follow a 2 step (plate and fill). Wouldn't this be inefficient as there is more time and processes spent?
Thanks a lot for any help,
Paul
I am very new to the PCB industry. Have a couple of questions that had bothered me. Hope you guys can help me out.
1) If we can use a solid via fill using conductive pastes to enable interconnection between layers, then why do most people still copper plate the side walls of the via holes first before filling the holes with conductive pastes. Isn't this double work?
2) For small via hole sizes, why do some people not metallized the vias completely using plating and instead follow a 2 step (plate and fill). Wouldn't this be inefficient as there is more time and processes spent?
Thanks a lot for any help,
Paul