Design for Micro Via

[jiayan]

Hi all,

I'm new for this forum. I would like to get some advise on micro via design.

i've a design with micro via on pad. The pith for the pin is 0.4 mm and the pad's size is 0.2140mm.
The problem is, i would like to change the pattern become snowman or normal dog bone. I found the micro via drill diameter need to reduce to 0.06 mm to fit into the 0.4mm pith. But I not sure whether the board house able to drill the hole size or not. Does any one know what is the smallest drill diameter can be reach for the micro via?

regards,
Jia Yan

[cadpro2k]

BIG, BIG, BIG issue, and I've encountered it with .4mm pitch BGAs. Make sure you have a note on the fabrication drawing that specifies the BGA pads SHALL be filled (capped) and flat to the surface. One problem with these devices is getting the most adequate solder paste amounts to the BGA pads. If you have slight indentations in the pad surfaces, it will degrade the solder paste amount. Make sure you spec to get a flat pad surface.

I'm doing uVia-in-pad designs with these .4mm buggers and the .5mm BGAs, and ALWAYS specify the flatness requirement.

Good day.
Mitch

[hong.qian]

Dear ,

The hole size may design to 0.2m .

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