Copper VS. Copper Pour

[AS21]

I am updating a board originally worked by a former consultant.
While updating the copper outlines on the TOP (surface layer) of the board I noticed that the pour was created using "COPPER" instead of "COPPER POUR". I changed it to a "COPPER POUR" with an attached net, it was originally a "COPPER" piece flooded over a trace.

What is the difference between using either in this case, besides the fact that you attach a net to the COPPER POUR? I am guessing that regular COPPER was used so that it doesn't need to be reflooded everytime - but I don't want to make a false assumption.

[randychase]

There are some differences. One, a copper piece will not void around pads or traces. This is useful when we used to use copper pour and wanted a flooded over pad, not a thermal. Or if we wanted an intentional short that Pour would not do.

I have also used copper instead of pour/flood in order to control exactly where the copper goes because it was required for current or such.

You can and should assign a net to copper also, just like you do in pour. Otherwise it will fail DRC.

Another reason may be that someone was just used to using copper instead of pour because they are used to the older PADS that did not have pour... or that had pour with bugs.