Carl_at_xrite
01-08-2002, 07:54 AM
Howdy All,
We have been having problems with one particular supplier as far as solderability on a fairly complex board.
We had the boards analyzed by an independant lab and discovered that the ratio of tin to lead was off but not consistantly
across the board.
The IPC Specification for solder is lame at best "covered and solderable"
I have seen specifications that state anything less than 200 micro Inches of solder over a pad is not sufficient enough to protect the base metal for any length of time.
Does anyone know where I can get an accurate specification regarding this?
Thanks in advance
Carl Goldenbusky
CAE/PCB Designer
X-rite incorporated
We have been having problems with one particular supplier as far as solderability on a fairly complex board.
We had the boards analyzed by an independant lab and discovered that the ratio of tin to lead was off but not consistantly
across the board.
The IPC Specification for solder is lame at best "covered and solderable"
I have seen specifications that state anything less than 200 micro Inches of solder over a pad is not sufficient enough to protect the base metal for any length of time.
Does anyone know where I can get an accurate specification regarding this?
Thanks in advance
Carl Goldenbusky
CAE/PCB Designer
X-rite incorporated