copper pour on top layer

[davepcb]

I just poured copper on layer 1. It worked well but for some reason there are no thermals on the pads of the bga or the break-out vias associated with those pads.

Is there a way to route a bga ground pad to a free via and flood over both of them and have thermals attached instead of a solid pour? I'm concerened that the flood over the pads will cause an imbalance of solder reflow and create cold solder joints.

Thanks,
Dave

[davepcb]

I was helped with this proble. The thermal spoke width was large enough to make it look like a solid flood over. I had to decrease the spoke width so that there would be thermals present on the top layer. The problem is that I want to have wider spokes on internal layers because many of the thermals overlap.

I'll work on a compromise.

dave