davepcb
09-15-2003, 10:33 AM
I was recently asked to explain what the phrase "There shall be evidence of positive etchback on the inner layers of the printed wiring board".
I found a definition for it:
Etchback .
During etchback, in addition to smear removal, the glass fibers themselves are etched back from the hole wall. The goal is to remove about 0.5 mil from the top and bottom of the innerlayer copper so that it will protrude out from the hole wall. This creates three surfaces (also known as a three-point connection) for the copper to bond to during the making holes conductive step. Glass etchants include hydrochloric acid, ammonium bifluoride, and hydrofluoric acid (rarely used). Etchback with plasma can be achieved by varying the type and amount of reactive gases.
It seems that the part "remove about 0.5 mil from the top and bottom of the innerlayer copper so that it will protrude out from the hole wall" should have been "remove about 0.5 mil from the top and bottom of the innerlayer FR4 so that the copper can protrude from the via. I get lost here.
Does this mean that the purpose of POSITIVE etchback is to improve the connection from a plated thru-hole to an internal trace?
Thanks,
Dave[B}FR4[/B]
I found a definition for it:
Etchback .
During etchback, in addition to smear removal, the glass fibers themselves are etched back from the hole wall. The goal is to remove about 0.5 mil from the top and bottom of the innerlayer copper so that it will protrude out from the hole wall. This creates three surfaces (also known as a three-point connection) for the copper to bond to during the making holes conductive step. Glass etchants include hydrochloric acid, ammonium bifluoride, and hydrofluoric acid (rarely used). Etchback with plasma can be achieved by varying the type and amount of reactive gases.
It seems that the part "remove about 0.5 mil from the top and bottom of the innerlayer copper so that it will protrude out from the hole wall" should have been "remove about 0.5 mil from the top and bottom of the innerlayer FR4 so that the copper can protrude from the via. I get lost here.
Does this mean that the purpose of POSITIVE etchback is to improve the connection from a plated thru-hole to an internal trace?
Thanks,
Dave[B}FR4[/B]