Studbumps...

[royl]

This is new stuff. Studbumps are for "flipchip technology". Any experience or gotchas or tips here?

[JivenJim]

I did some designs with these stud bumps as ground pads cut in rodgers duroid 4003 with silver bumps (pads) on a bunch of military designs about 7 years ago. The Duroid was single sided and laminated directly to the metal chase floor. Bail wire (magnetic) was used on the flip chips as per normal. I do recal that the reflow was a bit tricky where they used small balls filled in over duroid to apply pressure and keep things from moving during heating. I'll try looking around at home to see if I have the process specs if you think they would help.

Jim

[royl]

I would very much appreciate it. The job has not come in yet and I would like to try to brush up on this technology.

[JivenJim]

Royl,

I found some info on this design. Do You need flip chip design or only on the silver pads info. I also need an email and I'll scan them to you next week.

Jim

[royl]

I will e-mail you with my address...but it is available here as well.

THX!