jporter
06-11-2003, 06:19 AM
Greetings,
I have a 4oz board with a specific trace, designed for a given current at a 10 deg C rise over ambient. A terminal is soldered at a PTH on this trace.
In addition to classical calculations, I have a significant amount of test data to show the temperature induced by the mating device at this interface at various ambient temperatures. There will be no heat sink and I am ignoring convection for the time being. My question is, how can I calculate a size of additional copper at the pad to dissipate the heat induced by the device, given the t-rise and/or power dissipated so that I may (theoretically) maintain the 10 deg rise over the majority of the trace?
All comments and suggestions are appreciated.
Jason
I have a 4oz board with a specific trace, designed for a given current at a 10 deg C rise over ambient. A terminal is soldered at a PTH on this trace.
In addition to classical calculations, I have a significant amount of test data to show the temperature induced by the mating device at this interface at various ambient temperatures. There will be no heat sink and I am ignoring convection for the time being. My question is, how can I calculate a size of additional copper at the pad to dissipate the heat induced by the device, given the t-rise and/or power dissipated so that I may (theoretically) maintain the 10 deg rise over the majority of the trace?
All comments and suggestions are appreciated.
Jason